Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2024-12-10 |
| 12166128 | Multi-layer film device and method | Yao-Jen Chang, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih +1 more | 2024-12-10 |
| 12159830 | Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect | Hui-Chun LEE, Po-Hsiang Huang, Wen-Sheh Huang, Jen Hung Wang, Su-Jen Sung +1 more | 2024-12-03 |
| 12159838 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2024-12-03 |
| 11996361 | Method of making a contact structure | Shu-Cheng Chin, Yao-Min Liu, Hung-Wen Su, Chi-Feng Lin | 2024-05-28 |
| 11894437 | Hybrid conductive structures | Shuen-Shin Liang, Chien-Shun Liao, Keng-Chu Lin, Kai-Ting Huang, Sung-Li Wang +4 more | 2024-02-06 |