Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170331 | Conductive structures and methods of formation | Cheng-Wei Chang, Chia-Hung Chu, Hsu-Kai Chang, Sung-Li Wang, Kuan-Kan Hu +4 more | 2024-12-17 |
| 12148807 | Backside contact structures with stacked metal silicide layers for source/drain region of fin field transistors | Chia-Hung Chu, Ding-Kang Shih, Keng-Chu Lin, Pang-Yen Tsai, Sung-Li Wang +2 more | 2024-11-19 |
| 12112974 | Integrated circuit isolation feature and method of forming the same | Chih-Tang Peng, Keng-Chu Lin, Teng-Chun Tsai | 2024-10-08 |
| 12094952 | Air spacer formation with a spin-on dielectric material | Ting-Ting Chen, Chen-Han Wang, Keng-Chu Lin, Tsu-Hsiu Perng, Tsai-Jung Ho +3 more | 2024-09-17 |
| 12080766 | Epitaxial backside contact | Chia-Hung Chu, Tsungyu Hung, Hsu-Kai Chang, Ding-Kang Shih, Keng-Chu Lin +2 more | 2024-09-03 |
| 12068252 | Hybrid conductive structures | Cheng-Wei Chang, Chien-Shun Liao, Sung-Li Wang, Shu-Lan Chang, Yi-Ying Liu +2 more | 2024-08-20 |
| 12057397 | Capping layer for liner-free conductive structures | Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2024-08-06 |
| 12051592 | Method and structure for barrier-less plug | Sung-Li Wang, Hung-Yi Huang, Yu-Yun Peng, Mrunal A. Khaderbad, Chia-Hung Chu +1 more | 2024-07-30 |
| 12046634 | Dual side contact structures in semiconductor devices | Cheng-Wei Chang, Sung-Li Wang, Hsu-Kai Chang, Chia-Hung Chu, Chien-Shun Liao +1 more | 2024-07-23 |
| 12040372 | Contact structures in semiconductor devices | Hsu-Kai Chang, Jhih-Rong Huang, Yen-Tien Tung, Chia-Hung Chu, Tzer-Min Shen +2 more | 2024-07-16 |
| 12002867 | Contact structure for semiconductor device | Chia-Hung Chu, Hsu-Kai Chang, Tzu-Pei Chen, Kan-Ju Lin, Chien-Hung Chang +2 more | 2024-06-04 |
| 11972974 | Self-aligned barrier for metal vias | Sung-Li Wang, Yu-Yun Peng, Fang-Wei Lee, Chia-Hung Chu, Mrunal A. Khaderbad +1 more | 2024-04-30 |
| 11929327 | Liner-free conductive structures with anchor points | Hsu-Kai Chang, Keng-Chu Lin, Sung-Li Wang, Chia-Hung Chu | 2024-03-12 |
| 11901220 | Bilayer seal material for air gaps in semiconductor devices | Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2024-02-13 |
| 11894437 | Hybrid conductive structures | Chih-Chien Chi, Chien-Shun Liao, Keng-Chu Lin, Kai-Ting Huang, Sung-Li Wang +4 more | 2024-02-06 |