Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033863 | Semiconductor fabrication system embedded with effective baking module | Han-Yu Lin, Yi-Ruei Jhan, Li-Te Lin, Pinyen Lin, Tze-Chung Lin | 2024-07-09 |
| 12021125 | High selectivity etching with germanium-containing gases | Tze-Chung Lin, Pinyen Lin, Li-Te Lin, Han-Yu Lin | 2024-06-25 |
| 12009294 | Middle-of-line interconnect structure and manufacturing method | Cheng-Wei Chang, Sung-Li Wang, Yi-Ying Liu, Chia-Hung Chu | 2024-06-11 |
| 11972974 | Self-aligned barrier for metal vias | Sung-Li Wang, Shuen-Shin Liang, Yu-Yun Peng, Chia-Hung Chu, Mrunal A. Khaderbad +1 more | 2024-04-30 |
| 11973129 | Semiconductor device structure with inner spacer layer and method for forming the same | Han-Yu Lin, Chansyun David Yang, Tze-Chung Lin, Li-Te Lin, Pinyen Lin | 2024-04-30 |