Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166079 | 2D channel transistors with low contact resistance | Dhanyakumar Mahaveer Sathaiya, Wei-Yen Woon | 2024-12-10 |
| 12142649 | Semiconductor structure with conductive carbon layer and method for manufacturing the same | Jhih-Rong Huang, Yi-Bo Liao, Yen-Tien Tung, Wei-Yen Woon | 2024-11-12 |
| 12136660 | Semiconductor device, and method for protecting low-k dielectric feature of semiconductor device | Cheng-Ming Lin, Han-Yu Lin, Wei-Yen Woon | 2024-11-05 |
| 12136570 | Graphene layer for low resistance contacts and damascene interconnects | Wei-Yen Woon, Cheng-Ming Lin, Han-Yu Lin, Szu-Hua Chen, Jhih-Rong Huang +1 more | 2024-11-05 |
| 12087819 | Dual channel structure | Dhanyakumar Mahaveer Sathaiya, Keng-Chu Lin, Tzer-Min Shen | 2024-09-10 |
| 12074068 | Epitaxial structures for stacked semiconductor devices | Sathaiya Mahaveer DHANYAKUMAR, Huicheng Chang, Keng-Chu Lin, Winnie Victoria Wei-Ning Chen | 2024-08-27 |
| 12051592 | Method and structure for barrier-less plug | Sung-Li Wang, Hung-Yi Huang, Yu-Yun Peng, Chia-Hung Chu, Shuen-Shin Liang +1 more | 2024-07-30 |
| 12040328 | Semiconductor devices including two-dimensional material and methods of fabrication thereof | Sathaiya Dhanyakumar Mahaveer | 2024-07-16 |
| 11972974 | Self-aligned barrier for metal vias | Sung-Li Wang, Shuen-Shin Liang, Yu-Yun Peng, Fang-Wei Lee, Chia-Hung Chu +1 more | 2024-04-30 |
| 11942358 | Low thermal budget dielectric for semiconductor devices | Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, De-Yang Chiou, Yu-Yun Peng +1 more | 2024-03-26 |
| 11923367 | Low resistance fill metal layer material as stressor in metal gates | Ziwei Fang, Keng-Chu Lin, Hsueh Wen Tsau | 2024-03-05 |