Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942358 | Low thermal budget dielectric for semiconductor devices | Mrunal A. Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, Yu-Yun Peng +1 more | 2024-03-26 |
| 11942447 | Storage layers for wafer bonding | Fu-Ting Yen, Yu-Yun Peng, Keng-Chu Lin | 2024-03-26 |
| 11916022 | Photolithography alignment process for bonded wafers | Yeong-Jyh Lin, Ching-I Li, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang +2 more | 2024-02-27 |