Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051592 | Method and structure for barrier-less plug | Sung-Li Wang, Hung-Yi Huang, Mrunal A. Khaderbad, Chia-Hung Chu, Shuen-Shin Liang +1 more | 2024-07-30 |
| 12034075 | Device of dielectric layer | Keng-Chu Lin | 2024-07-09 |
| 11996363 | Interconnect structure including a heat dissipation layer and methods of forming the same | Keng-Chu Lin | 2024-05-28 |
| 11972974 | Self-aligned barrier for metal vias | Sung-Li Wang, Shuen-Shin Liang, Fang-Wei Lee, Chia-Hung Chu, Mrunal A. Khaderbad +1 more | 2024-04-30 |
| 11942447 | Storage layers for wafer bonding | De-Yang Chiou, Fu-Ting Yen, Keng-Chu Lin | 2024-03-26 |
| 11942358 | Low thermal budget dielectric for semiconductor devices | Mrunal A. Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, De-Yang Chiou +1 more | 2024-03-26 |
| 11935752 | Device of dielectric layer | Chung-Chi Ko, Keng-Chu Lin | 2024-03-19 |
| 11908921 | Transistor isolation structures | Fu-Ting Yen, Keng-Chu Lin | 2024-02-20 |