Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119404 | Gate all around structure with additional silicon layer and method for forming the same | Pei-Hsun Wang, Chun-Hsiung Lin, Chih-Hao Wang | 2024-10-15 |
| 12094952 | Air spacer formation with a spin-on dielectric material | Ting-Ting Chen, Keng-Chu Lin, Shuen-Shin Liang, Tsu-Hsiu Perng, Tsai-Jung Ho +3 more | 2024-09-17 |
| 11942358 | Low thermal budget dielectric for semiconductor devices | Mrunal A. Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, De-Yang Chiou, Yu-Yun Peng +1 more | 2024-03-26 |
| 11901220 | Bilayer seal material for air gaps in semiconductor devices | Shuen-Shin Liang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2024-02-13 |