Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154822 | Dummy fin structures and methods of forming same | Chin-Hsiang Lin, Keng-Chu Lin, Shwang-Ming Jeng, Teng-Chun Tsai, Tsu-Hsiu Perng | 2024-11-26 |
| 11942447 | Storage layers for wafer bonding | De-Yang Chiou, Yu-Yun Peng, Keng-Chu Lin | 2024-03-26 |
| 11915936 | Semiconductor structure and manufacturing method thereof | Chia-Wei Su, Ting-Ting Chen, Teng-Chun Tsai | 2024-02-27 |
| 11908921 | Transistor isolation structures | Yu-Yun Peng, Keng-Chu Lin | 2024-02-20 |