Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176217 | Method for manufacturing a semiconductor using slurry | Chun-Hung Liao, Chung-Wei Hsu, Tsung-Ling Tsai, Chen-Hao Wu, An-Hsuan Lee +2 more | 2024-12-24 |
| 12154822 | Dummy fin structures and methods of forming same | Chin-Hsiang Lin, Keng-Chu Lin, Shwang-Ming Jeng, Tsu-Hsiu Perng, Fu-Ting Yen | 2024-11-26 |
| 12112974 | Integrated circuit isolation feature and method of forming the same | Chih-Tang Peng, Shuen-Shin Liang, Keng-Chu Lin | 2024-10-08 |
| 12080779 | Capping layer for gate electrodes | Chin-Hsiang Lin, Huang-Lin Chao, Akira Mineji | 2024-09-03 |
| 12024651 | Chemical mechanical polishing slurry composition and method of polishing metal layer | Chun-Hung Liao, An-Hsuan Lee, Shen-Nan Lee, Chen-Hao Wu, Huang-Lin Chao | 2024-07-02 |
| 12009253 | Semiconductor structure with staggered selective growth | Zhi-Chang Lin, Wei-Hao Wu | 2024-06-11 |
| 11961900 | Integrated circuit with a fin and gate structure and method making the same | Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang | 2024-04-16 |
| 11942373 | Fin isolation structure for FinFET and method of forming the same | Chu-An Lee, Chen-Hao Wu, Peng-Chung Jangjian, Chun-Wen Hsiao, Huang-Lin Chao | 2024-03-26 |
| 11923251 | Methods of cutting metal gates and structures formed thereof | Tsu-Hsiu Perng, Kai-Chieh Yang, Zhi-Chang Lin, Wei-Hao Wu | 2024-03-05 |
| 11916131 | Vertical device having a protrusion source | De-Fang Chen, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang +1 more | 2024-02-27 |
| 11915936 | Semiconductor structure and manufacturing method thereof | Chia-Wei Su, Fu-Ting Yen, Ting-Ting Chen | 2024-02-27 |
| 11865666 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Shen-Nan Lee +1 more | 2024-01-09 |