Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176217 | Method for manufacturing a semiconductor using slurry | Chun-Hung Liao, Chung-Wei Hsu, Tsung-Ling Tsai, Chen-Hao Wu, An-Hsuan Lee +2 more | 2024-12-24 |
| 12024651 | Chemical mechanical polishing slurry composition and method of polishing metal layer | Chun-Hung Liao, An-Hsuan Lee, Teng-Chun Tsai, Chen-Hao Wu, Huang-Lin Chao | 2024-07-02 |
| 11865666 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Teng-Chun Tsai +1 more | 2024-01-09 |