Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148659 | Contact conductive feature formation and structure | Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2024-11-19 |
| 12057397 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2024-08-06 |
| 12020981 | Conductive feature formation and structure | Yu-Shih Wang, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2024-06-25 |
| 11955329 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Ken-Yu Chang, Yi-Ying Liu | 2024-04-09 |
| 11955379 | Metal adhesion layer to promote metal plug adhesion | Pei-Wen Wu, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai | 2024-04-09 |
| 11929314 | Interconnect structures including a fin structure and a metal cap | Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao +4 more | 2024-03-12 |