Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148659 | Contact conductive feature formation and structure | Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin | 2024-11-19 |
| 12057397 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2024-08-06 |
| 12020981 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ming-Hsing Tsai, Wei-Jung Lin | 2024-06-25 |
| 11955329 | Method of forming conductive feature including cleaning step | Cheng-Wei Chang, Min-Hsiu Hung, Chun-I Tsai, Yi-Ying Liu | 2024-04-09 |
| 11929314 | Interconnect structures including a fin structure and a metal cap | Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao +4 more | 2024-03-12 |