Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12065731 | Tungsten deposition on a cobalt surface | Pei-Wen Wu, Yu-Sheng Wang, Pei Shan Chang | 2024-08-20 |
| 12068197 | Methods for forming contact plugs with reduced corrosion | Yu-Sheng Wang, Chen-Yuan Kao, Yi-Wei Chiu, Liang-Yueh Ou Yang, Yueh-Ching Pai | 2024-08-20 |
| 12021147 | FinFET structures and methods of forming the same | Yu-Sheng Wang, Chia-Ching Lee, Chung-Chiang Wu, Ching-Hwanq Su | 2024-06-25 |
| 11955379 | Metal adhesion layer to promote metal plug adhesion | Pei-Wen Wu, Chun-I Tsai, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai | 2024-04-09 |
| 11901188 | Method for improved critical dimension uniformity in a semiconductor device fabrication process | Chun-Kuang Chen, De-Fang Chen, Wei-Liang Lin, Yu-Tien Shen | 2024-02-13 |