Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Hsin-Ying Peng +4 more | 2024-12-10 |
| 11996361 | Method of making a contact structure | Shu-Cheng Chin, Yao-Min Liu, Hung-Wen Su, Chih-Chien Chi | 2024-05-28 |