Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165975 | Method of forming interconnect structure having a barrier layer | Shu-Cheng Chin, Ming-Yuan Gao, Chen-Yi Niu, Yen-Chun Lin, Chih-Hsiang Chang +4 more | 2024-12-10 |
HP
Hsin-Ying Peng
Overall (2024): #440,269 of 561,600Top 80%
1
Patents 2024