Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142565 | Different via configurations for different via interface requirements | Po-Yu Huang, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang +3 more | 2024-11-12 |
| 12080769 | Contact structure with silicide and method for forming the same | Kai-Hsuan Lee, Po-Yu Huang, Shih-Chieh Wu, I-Wen Wu, Chen-Ming Lee +2 more | 2024-09-03 |
| 12074063 | Contact formation method and related structure | Chao-Hsun Wang, Chia-Hsien Yao, Fu-Kai Yang, Mei-Yun Wang | 2024-08-27 |
| 12057392 | Conductive features having varying resistance | Jia-En Lee, Po-Yu Huang, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +1 more | 2024-08-06 |