Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12075709 | Tungsten via for a magnetic tunnel junction interconnect | Ya-Ling Lee, Ming-Hsing Tsai | 2024-08-27 |
| 11935935 | Transistor including a hydrogen-diffusion barrier and methods for forming the same | Min Dai, I-Cheng Chang, Cheng-Yi Wu, Han-Ting Tsai, Tsann Lin +1 more | 2024-03-19 |