Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094757 | Method for manufacturing semiconductor device with semiconductor capping layer | Po-Kai Hsiao, Hui-Cheng Chang, Yee-Chia Yeo | 2024-09-17 |
| 12087592 | Ambient controlled two-step thermal treatment for spin-on coating layer planarization | Chen-Fong Tsai, Ya-Lun CHEN, Yahru Cheng, Huicheng Chang, Yee-Chia Yeo | 2024-09-10 |
| 11996317 | Methods for forming isolation regions by depositing and oxidizing a silicon liner | Po-Kai Hsiao, Han-De Chen, Huicheng Chang, Yee-Chia Yeo | 2024-05-28 |
| 11901189 | Ambient controlled two-step thermal treatment for spin-on coating layer planarization | Chen-Fong Tsai, Ya-Lun CHEN, Yahru Cheng, Huicheng Chang, Yee-Chia Yeo | 2024-02-13 |