Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094757 | Method for manufacturing semiconductor device with semiconductor capping layer | Po-Kai Hsiao, Tsai-Yu Huang, Yee-Chia Yeo | 2024-09-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094757 | Method for manufacturing semiconductor device with semiconductor capping layer | Po-Kai Hsiao, Tsai-Yu Huang, Yee-Chia Yeo | 2024-09-17 |