Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087732 | Isolation bonding film for semiconductor packages and methods of forming the same | Ku-Feng Yang, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2024-09-10 |
| 12074064 | TSV structure and method forming same | Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2024-08-27 |
| 11869869 | Heterogeneous dielectric bonding scheme | Chen-Hua Yu, Wen-Chih Chiou, Ku-Feng Yang | 2024-01-09 |