Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159860 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Wen-Chih Chiou | 2024-12-03 |
| 12142485 | Semiconductor structure and manufacturing method thereof | Hung-Pin Chang, Wen-Chih Chiou | 2024-11-12 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2024-11-12 |
| 12074064 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2024-08-27 |
| 12015008 | Wafer bonding method | Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2024-06-18 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11948920 | Semiconductor device and method for manufacturing the same, and semiconductor package | I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin +1 more | 2024-04-02 |