Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su +1 more | 2024-12-03 |
| 12142524 | Via for component electrode connection | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-11-12 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2024-09-10 |
| 12062602 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin | 2024-08-13 |
| 12033949 | Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2024-07-09 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu +1 more | 2024-04-16 |
| 11961796 | Semiconductor package dielectric substrate including a trench | Yueh-Ting Lin, Hua-Wei Tseng, Der-Chyang Yeh | 2024-04-16 |
| 11935836 | Semiconductor devices | Yu-Hung Lin, An-Jhih Su, Der-Chyang Yeh, Shih-Guo Shen, Chia-Nan Yuan | 2024-03-19 |