Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062602 | Semiconductor package and method of manufacturing the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Shih Yeh | 2024-08-13 |
CL
Chiang-Hung Lin
Overall (2024): #509,807 of 561,600Top 95%
1
Patents 2024