Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170207 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2024-12-17 |
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, An-Jhih Su, Ming-Shih Yeh +1 more | 2024-12-03 |
| 12119320 | Chip package structure with bump | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2024-10-15 |
| 12087745 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Po-Hao Tsai +2 more | 2024-09-10 |
| 12062602 | Semiconductor package and method of manufacturing the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Chiang-Hung Lin, Ming-Shih Yeh | 2024-08-13 |
| 11984422 | Semiconductor package and method of forming same | Yao-Chun Chuang, SyuFong Li, Ching-Pin Lin, Jun He | 2024-05-14 |
| 11984410 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Yu-Hsiang Hu | 2024-05-14 |
| 11929322 | Method of forming device and package structure | Hsien-Wei Chen, An-Jhih Su | 2024-03-12 |