Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159853 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2024-12-03 |
| 11984410 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu | 2024-05-14 |
| 11961796 | Semiconductor package dielectric substrate including a trench | Hua-Wei Tseng, Ming-Shih Yeh, Der-Chyang Yeh | 2024-04-16 |