HS

Hong-Ye Shih

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 New Taipei, TW: #607 of 1,741 inventorsTop 35%
Overall (2024): #441,222 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12051672 Package structure and method of forming the same Yi-Hsiu Chen, Ebin Liao, Wen-Chih Chiou, Jia-Ling Ko 2024-07-30