Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148719 | Forming large chips through stitching | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou | 2024-11-19 |
| 12108069 | Method, apparatus, system, and electronic device for transmitting composite photo data | Qingsen Zhang, Junling Chen, Jiashu Huang, Qibang Yi | 2024-10-01 |
| 12062590 | Method for manufacturing semiconductor package structure | Ting-Yu Yeh, Chia-Hao Hsu, Kuo-Chiang Ting, Tu-Hao Yu, Shang-Yun Hou | 2024-08-13 |
| 12027455 | Chip-on-wafer structure with Chiplet Interposer | Kuo-Chiang Ting, Shang-Yun Hou | 2024-07-02 |
| 11996371 | Chiplet interposer | Shang-Yun Hou, Kuo-Chiang Ting, Hsien-Pin Hu, Wen-Chih Chiou, Chen-Hua Yu | 2024-05-28 |
| 11950700 | Sofa backrest connection structure and sofa assembly | Xiaohong Li | 2024-04-09 |
| 11864657 | Sofa seat frame, sofa base assembly, sofa and sofa production and assembly process | Xiaohong Li | 2024-01-09 |