JH

Jian-Wei Hong

TSMC: 1 patents #2,264 of 4,162Top 55%
Overall (2024): #416,756 of 561,600Top 75%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12166014 Manufacturing method of package Ming-Fa Chen, Sung-Feng Yeh 2024-12-10