Issued Patents 2024
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080629 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Hsien-Wei Chen, Sen-Bor Jan | 2024-09-03 |
| 12074131 | Package structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sen-Bor Jan, Sung-Feng Yeh | 2024-08-27 |
| 12074140 | System formed through package-in-package formation | Chen-Hua Yu, Sung-Feng Yeh | 2024-08-27 |
| 12074136 | Package structure and method of manufacturing the same | Tzuan-Horng Liu, Hsien-Wei Chen, Jiun-Heng Wang | 2024-08-27 |
| 12068285 | Stacked die structure and method of fabricating the same | Jie Chen, Hsien-Wei Chen | 2024-08-20 |
| 12062608 | Semiconductor packages | Jie Chen, Hsien-Wei Chen | 2024-08-13 |
| 12057439 | Integrated circuit packages | Tzuan-Horng Liu, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu | 2024-08-06 |
| 12057438 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Hsien-Wei Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-08-06 |
| 12057437 | Package structure, chip structure and method of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2024-08-06 |
| 12051673 | Package having multiple chips integrated therein and manufacturing method thereof | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2024-07-30 |
| 12046579 | Package having bonding layers | Chao-Wen Shih, Hsien-Wei Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-07-23 |
| 12020997 | Methods of forming semiconductor device packages having alignment marks on a carrier substrate | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2024-06-25 |
| 12021057 | Semiconductor structure and semiconductor die | Hsien-Wei Chen | 2024-06-25 |
| 12015013 | Die stack structure, semiconductor structure and method of fabricating the same | Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-06-18 |
| 12009386 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Ying-Ju Chen, Jie Chen | 2024-06-11 |
| 12002778 | Semiconductor packages and methods of forming the same | Hsien-Wei Chen, Sung-Feng Yeh, Jie Chen | 2024-06-04 |
| 11978716 | Package | Sung-Feng Yeh, Hsien-Wei Chen | 2024-05-07 |
| 11973170 | Semiconductor package and manufacturing method of semiconductor package | Hsien-Wei Chen, Jie Chen | 2024-04-30 |
| 11967553 | Semiconductor package and manufacturing method of the same | Sung-Feng Yeh, Chen-Hua Yu | 2024-04-23 |
| 11965852 | Microelectromechanical sensor and sensing module thereof | Pei-Chi KUO, Bor-Shiun Lee | 2024-04-23 |
| 11960127 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2024-04-16 |
| 11955433 | Package-on-package device | Sung-Feng Yeh, Hsien-Wei Chen | 2024-04-09 |
| 11942454 | Package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2024-03-26 |
| 11942436 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ying-Ju Chen | 2024-03-26 |
| 11935802 | Integrated circuit package and method of forming same | Hsien-Wei Chen, Chen-Hua Yu | 2024-03-19 |