Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074136 | Package structure and method of manufacturing the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2024-08-27 |
JW
Jiun-Heng Wang
Overall (2024): #413,895 of 561,600Top 75%
1
Patents 2024