Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996345 | Package structure and manufacturing method thereof | Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2024-05-28 |
| 11869822 | Semiconductor package and manufacturing method thereof | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2024-01-09 |