Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119237 | Semiconductor device package having metal thermal interface material | Chin-Fu Kao, Chen-Shien Chen | 2024-10-15 |
| 12100754 | Semiconductor arrangement and method of making | Chi-Fu Lin, Cheng-Hsin Chen, Ming-I Hsu, Kun-Ming Huang | 2024-09-24 |
| 12027603 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2024-07-02 |
| 12002774 | Passivation scheme for pad openings and trenches | Ming-Hong Chang, Chun-Yi Yang, Kun-Ming Huang, Po-Tao Chu, Shen-Ping Wang | 2024-06-04 |
| 11901433 | Semiconductor device | Jheng-Sheng YOU, Hsin-Chih Lin, Kun-Ming Huang, Lieh-Chuan Chen, Po-Tao Chu +1 more | 2024-02-13 |