Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040289 | Interposer including a copper edge seal ring structure and methods of forming the same | Hong-Seng Shue, Ming-Da Cheng, Ching-Wen Hsiao, Yao-Chun Chuang, Chen-Shien Chen | 2024-07-16 |
| 11908790 | Chip structure with conductive via structure and method for forming the same | Ting-Li Yang, Po-Hao Tsai, Ching-Wen Hsiao, Hong-Seng Shue | 2024-02-20 |