Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068300 | Chip-on-wafer-on-substrate package with improved yield | Chia-Wei Chang, Ju-Min Chen, Yao-Chun Chuang | 2024-08-20 |
JW
Jyun-Lin Wu
Overall (2024): #395,149 of 561,600Top 75%
1
Patents 2024