Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176337 | Semiconductor devices and methods of manufacturing | Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung, Po-Hao Tsai +1 more | 2024-12-24 |
| 12094819 | Method for forming package structure | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2024-09-17 |
| 12051654 | Package structure and method of fabricating the same | Shin-Puu Jeng, Shih-Ting Hung, Po-Yao Chuang | 2024-07-30 |
| 11901277 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Meng-Liang Lin, Shin-Puu Jeng, Po-Yao Chuang | 2024-02-13 |
| 11901279 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Meng-Liang Lin, Shin-Puu Jeng, Po-Yao Chuang | 2024-02-13 |