Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176258 | Semiconductor package and method manufacturing the same | Shin-Puu Jeng | 2024-12-24 |
| 12154888 | Semiconductor package and method of manufacturing the same | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng | 2024-11-26 |
| 12125833 | Integrated circuit package and method forming same | Shin-Puu Jeng, Shuo-Mao Chen | 2024-10-22 |
| 12125755 | Chip package structure with cavity in interposer | Shin-Puu Jeng, Shuo-Mao Chen | 2024-10-22 |
| 12113025 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Po-Yao Lin | 2024-10-08 |
| 12094810 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng | 2024-09-17 |
| 12046548 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Shuo-Mao Chen, Techi Wong | 2024-07-23 |
| 11948914 | Chip package structure with integrated device integrated beneath the semiconductor chip | Shin-Puu Jeng, Shuo-Mao Chen | 2024-04-02 |
| 11942408 | Semiconductor structure and manufacturing method thereof | Shuo-Mao Chen, Shin-Puu Jeng | 2024-03-26 |
| 11915992 | Method for forming package structure with lid | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen, Chin-Hua Wang | 2024-02-27 |
| 11887952 | Semiconductor device encapsulated by molding material attached to redistribution layer | Shin-Puu Jeng, Shuo-Mao Chen | 2024-01-30 |
| 11862469 | Package structure and method of manufacturing the same | Shuo-Mao Chen, Shin-Puu Jeng | 2024-01-02 |
| 11862528 | Method for forming semiconductor package | Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2024-01-02 |