Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113025 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Shuo-Mao Chen, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2024-10-08 |
| 12009316 | Semiconductor structure and method of manufacturing a semiconductor structure | Hsien-Wei Chen, Jie Chen | 2024-06-11 |