Issued Patents 2024
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087705 | Package structure with warpage-control element | Yu-Sheng Lin, Chien-Hung Chen, Po-Chen Lai, Po-Yao Lin | 2024-09-10 |
| 12074083 | Semiconductor die package with thermal management features | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang | 2024-08-27 |
| 12074104 | Integrated circuit packages with ring-shaped substrates | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang | 2024-08-27 |
| 12074101 | Package structure and method of fabricating the same | Yu-Sheng Lin, Han-Hsiang Huang, Chien-Sheng Chen, Shu-Shen Yeh | 2024-08-27 |
| 12068260 | Semiconductor die package with ring structure and method for forming the same | Yu-Chen Lee, Shu-Shen Yeh, Chia-Kuei Hsu, Po-Yao Lin | 2024-08-20 |
| 12057424 | Package structure and method for forming the same | Meng-Liang Lin, Po-Yao Chuang | 2024-08-06 |
| 12057363 | Chip package structure with multiple gap-filling layers and fabricating method thereof | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Chin-Hua Wang | 2024-08-06 |
| 12051654 | Package structure and method of fabricating the same | Yi-Wen Wu, Shih-Ting Hung, Po-Yao Chuang | 2024-07-30 |
| 12046548 | Chip package with redistribution structure having multiple chips | Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2024-07-23 |
| 12040285 | Structure and formation method of chip package with reinforcing structures | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Yu-Sheng Lin | 2024-07-16 |
| 12040267 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin | 2024-07-16 |
| 12033913 | Chip package structure with lid and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin | 2024-07-09 |
| 12033871 | Method for forming semiconductor die package with ring structure comprising recessed parts | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin | 2024-07-09 |
| 12033906 | Semiconductor package and manufacturing method thereof | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin | 2024-07-09 |
| 12033928 | Manufacturing method of semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin | 2024-07-09 |
| 12033947 | Semiconductor package structure and method for forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin | 2024-07-09 |
| 12035475 | Semiconductor package with stress reduction design and method for forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin | 2024-07-09 |
| 12021064 | Semiconductor devices and methods of manufacture | Hsien-Wei Chen | 2024-06-25 |
| 12021045 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Ming-Chih Yew | 2024-06-25 |
| 12021014 | Bump joint structure with distortion and method forming same | Po-Yao Lin | 2024-06-25 |
| 12014969 | Package structure and method for forming the same | Po-Chen Lai, Ming-Chih Yew, Li-Ling Liao, Chin-Hua Wang, Po-Yao Lin | 2024-06-18 |
| 12009276 | Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin | 2024-06-11 |
| 12009278 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin | 2024-06-11 |
| 11996346 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Hui Yu, Shyue-Ter Leu | 2024-05-28 |
| 11997842 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin | 2024-05-28 |