Issued Patents 2024
Showing 76–80 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862580 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2024-01-02 |
| 11862528 | Method for forming semiconductor package | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Wen-Yi Lin, Shu-Shen Yeh | 2024-01-02 |
| 11862606 | Packages with metal line crack prevention design | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2024-01-02 |
| 11862469 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shuo-Mao Chen | 2024-01-02 |
| 11862549 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Chin-Hua Wang, Po-Yao Lin | 2024-01-02 |