Issued Patents 2024
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973001 | Semiconductor device and method of manufacture | Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-04-30 |
| 11967582 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2024-04-23 |
| 11967547 | Solder resist structure to mitigate solder bridge risk | Chin-Hua Wang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-04-23 |
| 11955455 | Embedded stress absorber in package | Shin-Puu Jeng, Chien-Sheng Chen, Po-Yao Lin, Po-Chen Lai | 2024-04-09 |
| 11915991 | Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof | Po-Yao Lin, Yu-Sheng Lin, Po-Chen Lai, Shin-Puu Jeng | 2024-02-27 |
| 11908757 | Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-02-20 |
| 11894320 | Semiconductor device package with stress reduction design and method of forming the same | Chin-Hua Wang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-02-06 |
| 11862580 | Semiconductor package | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-01-02 |
| 11862528 | Method for forming semiconductor package | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin | 2024-01-02 |