Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159847 | Integrated fan-out structures and methods for forming the same | Tsui-Mei Chen, Tsung-Jen Liao, Li-Huan Chu | 2024-12-03 |
| 12051624 | Stacked semiconductor devices and methods of forming thereof | Tsung-Hsing Lu, Jun He, Li-Huan Chu | 2024-07-30 |
| 12016126 | Carrier tape system and components and methods of use | Sung-Sheng Chiu, Tsui-Mei Chen, Shih-Hsing Lin, Li-Huan Chu | 2024-06-18 |
| 11990423 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Li-Huan Chu | 2024-05-21 |
| 11978729 | Semiconductor device package having warpage control and method of forming the same | Heh-Chang Huang, Fu-Jen Li, Shyue-Ter Leu | 2024-05-07 |
| 11894331 | Chip package structure, chip structure and method for forming chip structure | Chien-Cheng Chen | 2024-02-06 |