Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107038 | Semiconductor packages | Shu-Jung Tseng | 2024-10-01 |
| 11978729 | Semiconductor device package having warpage control and method of forming the same | Heh-Chang Huang, Pei-Haw Tsao, Shyue-Ter Leu | 2024-05-07 |