Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsien-Pin Hu, Tsung-Shu Lin, Tsung-Yu Chen, Wen-Hsin Wei | 2024-09-17 |