Issued Patents 2024
Showing 26–50 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100672 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2024-09-24 |
| 12100698 | Semiconductor device and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2024-09-24 |
| 12094860 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chung-Hao Tsai, Tzu-Chun Tang | 2024-09-17 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2024-09-17 |
| 12092861 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia | 2024-09-17 |
| 12087732 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Wen-Chih Chiou | 2024-09-10 |
| 12087757 | Integrated circuit packages | Chung-Hao Tsai, Chuei-Tang Wang | 2024-09-10 |
| 12080615 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2024-09-03 |
| 12080684 | Die stacks and methods forming same | Chung-Hao Tsai, Chuei-Tang Wang | 2024-09-03 |
| 12080563 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Kai-Chiang Wu | 2024-09-03 |
| 12074127 | Semiconductor die contact structure and method | Chung-Shi Liu | 2024-08-27 |
| 12074140 | System formed through package-in-package formation | Sung-Feng Yeh, Ming-Fa Chen | 2024-08-27 |
| 12074143 | Integrated circuit package and method | Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2024-08-27 |
| 12074064 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2024-08-27 |
| 12074122 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2024-08-27 |
| 12068295 | Deep partition power delivery with deep trench capacitor | Chung-Hao Tsai, Chuei-Tang Wang, Chieh-Yen Chen | 2024-08-20 |
| 12068297 | Hybrid integrated circuit package | Jiun Yi Wu, Hsing-Kuo Hsia | 2024-08-20 |
| 12062603 | Semiconductor device having via sidewall adhesion with encapsulant | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2024-08-13 |
| 12062640 | Semiconductor device and manufacturing method thereof | Wen-Chih Chiou | 2024-08-13 |
| 12057406 | Package having redistribution layer structure with protective layer | Kuo-Chung Yee, Chun-Hui Yu | 2024-08-06 |
| 12057438 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-08-06 |
| 12058101 | Package structure and method of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen | 2024-08-06 |
| 12057405 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai | 2024-08-06 |
| 12057359 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2024-08-06 |
| 12057407 | Semiconductor package and method | Jeng-Shien Hsieh, Chuei-Tang Wang, Chieh-Yen Chen | 2024-08-06 |