Issued Patents 2024
Showing 76–100 of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002799 | Die stacking structure and method forming same | Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2024-06-04 |
| 12002761 | Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device | Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih | 2024-06-04 |
| 11996227 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2024-05-28 |
| 11996383 | Bonded semiconductor devices and methods of forming the same | Tung-Liang Shao, Chih-Hang Tung | 2024-05-28 |
| 11996371 | Chiplet interposer | Shang-Yun Hou, Weiming Chris Chen, Kuo-Chiang Ting, Hsien-Pin Hu, Wen-Chih Chiou | 2024-05-28 |
| 11990381 | Integrated circuit packages having support rings | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2024-05-21 |
| 11984405 | Pad structure design in fan-out package | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2024-05-14 |
| 11984374 | Warpage control of packages using embedded core frame | Jiun Yi Wu, Chung-Shi Liu | 2024-05-14 |
| 11978691 | Semiconductor device and manufacturing method thereof | Kuo-Chung Yee | 2024-05-07 |
| 11973074 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia | 2024-04-30 |
| 11967553 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Sung-Feng Yeh | 2024-04-23 |
| 11967563 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2024-04-23 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2024-04-23 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11961814 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Jiun Yi Wu, Chung-Shi Liu | 2024-04-16 |
| 11961811 | Semiconductor structures and method of manufacturing the same | Hung-Jui Kuo, Hui-Jung Tsai, Tsao-Lun Chang | 2024-04-16 |
| 11961789 | Semiconductor package and manufacturing method thereof | Chun-Hui Yu, Kuo-Chung Yee | 2024-04-16 |
| 11955405 | Semiconductor package including thermal interface structures and methods of forming the same | Jen-Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung | 2024-04-09 |
| 11955442 | Semiconductor package and method | Jiun Yi Wu, Chung-Shi Liu | 2024-04-09 |
| 11955378 | Bonding method of package components and bonding apparatus | Yi-Li Hsiao, Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang | 2024-04-09 |
| 11955349 | Anisotropic carrier for high aspect ratio fanout | Chien Ling Hwang | 2024-04-09 |
| 11953740 | Package structure | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2024-04-09 |
| 11948862 | Package structures and method of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen | 2024-04-02 |
| 11948930 | Semiconductor package and method of manufacturing the same | Chin-Chuan Chang, Szu-Wei Lu | 2024-04-02 |
| 11948926 | Integrated circuit package and method | Wei Ling Chang, Chuei-Tang Wang, Chieh-Yen Chen | 2024-04-02 |