Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967563 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Chen-Hua Yu, Wei-Cheng Wu, Hsien-Wei Chen | 2024-04-23 |
| 11955439 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Tsung-Shu Lin | 2024-04-09 |