Issued Patents 2024
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176299 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more | 2024-12-24 |
| 12176026 | Static random access memory with a supplementary driver circuit and method of controlling the same | Chih-Yu Lin, Kao-Cheng Lin, Yen-Huei Chen | 2024-12-24 |
| 12167594 | Semiconductor device and manufacturing method thereof | Chen-Chin Liu, Yi Hsien Lu, Yu-Hsiung Wang, Juo-Li Yang | 2024-12-10 |
| 12136627 | 3DIC structure for high voltage device on a SOI substrate | Harry-Hak-Lay Chuang, Wen-Tuo Huang, Hsin Fu Lin | 2024-11-05 |
| 12127399 | Array boundary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Li-Feng Teng, Chien-Hung Chang | 2024-10-22 |
| 12115291 | Electric heating fragrance diffuser | — | 2024-10-15 |
| D1046266 | Combined wick and wick holder | — | 2024-10-08 |
| 12107001 | Semiconductor feature and method for manufacturing the same | Harry-Hak-Lay Chuang, Chung-Jen Huang, Wen-Tuo Huang | 2024-10-01 |
| D1044053 | Combined wick and wick holder | — | 2024-09-24 |
| D1044052 | Combined wick and wick holder | — | 2024-09-24 |
| 12096621 | Multi-type high voltage devices fabrication for embedded memory | Li-Feng Teng | 2024-09-17 |
| 12087809 | Semiconductor device having capacitor and manufacturing method thereof | Meng-Han Lin, Te-Hsin Chiu, Te-An Chen | 2024-09-10 |
| 12068313 | Semiconductor arrangement and formation thereof | Harry-Hak-Lay Chuang, Shih-Chang Liu, Ming Chyi Liu | 2024-08-20 |
| 12058856 | Semiconductor device and manufacturing method thereof | Li-Feng Teng | 2024-08-06 |
| 12048163 | Trench gate high voltage transistor for embedded memory | Alexander Kalnitsky, Chien-Hung Chang | 2024-07-23 |
| 12028598 | Methods and systems for identifying camera lens | — | 2024-07-02 |
| 12015029 | Method to embed planar FETs with finFETs | Harry-Hak-Lay Chuang, Li-Feng Teng, Li-Jung Liu | 2024-06-18 |
| 12009402 | Method of forming a gate structure in high-κ metal gate technology | Alexander Kalnitsky, Shih-Hao Lo, Hung-Pin Ko | 2024-06-11 |
| 11978740 | Semiconductor-on-insulator (SOI) semiconductor structures including a high-k dielectric layer and methods of manufacturing the same | Harry-Hak-Lay Chuang, Kuo-Ching Huang, Hsin Fu Lin, Henry Wang, Chien-Hung Liu +2 more | 2024-05-07 |
| 11967563 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Hsien-Wei Chen | 2024-04-23 |
| 11961826 | Bonded wafer device structure and methods for making the same | Harry-Hak-Lay Chuang, Wen-Tuo Huang | 2024-04-16 |
| 11955439 | Semiconductor package with redistribution structure and manufacturing method thereof | Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2024-04-09 |
| D1019311 | Soldering tool | — | 2024-03-26 |
| 11943921 | Embedded memory with improved fill-in window | Meng-Han Lin, Te-Hsin Chiu | 2024-03-26 |
| 11933493 | Tool with improved ignition efficiency | Cheng-Nan Yang | 2024-03-19 |