Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165955 | Semiconductor arrangement and method for making | Josh Lin, Yun-Chi Wu, Tsung-Yu Yang | 2024-12-10 |
| 12144173 | Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technology | Cheng-Bo Shu, Yun-Chi Wu | 2024-11-12 |
| 12114503 | Integrated chip including a tunnel dielectric layer which has different thicknesses over a protrusion region of a substrate | Jui-Yu Pan, Cheng-Bo Shu, Jing-Ru Lin, Tsung-Yu Yang, Yun-Chi Wu +1 more | 2024-10-08 |
| 12107001 | Semiconductor feature and method for manufacturing the same | Harry-Hak-Lay Chuang, Wen-Tuo Huang, Wei-Cheng Wu | 2024-10-01 |
| 12094984 | Semiconductor device | Cheng-Bo Shu, Yun-Chi Wu | 2024-09-17 |