Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12127399 | Array boundary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Wei-Cheng Wu, Chien-Hung Chang | 2024-10-22 |
| 12096621 | Multi-type high voltage devices fabrication for embedded memory | Wei-Cheng Wu | 2024-09-17 |
| 12058856 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2024-08-06 |
| 12015029 | Method to embed planar FETs with finFETs | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Li-Jung Liu | 2024-06-18 |