Issued Patents 2024
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131998 | Integrated circuit, system and method of forming same | Kam-Tou Sio, Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2024-10-29 |
| 12127399 | Array boundary structure to reduce dishing | Meng-Han Lin, Wei-Cheng Wu, Li-Feng Teng, Chien-Hung Chang | 2024-10-22 |
| 12101922 | Memory device and layout, manufacturing method of the same | Jiann-Tyng Tzeng, Shih-Wei Peng, Wei-An Lai | 2024-09-24 |
| 12087809 | Semiconductor device having capacitor and manufacturing method thereof | Meng-Han Lin, Wei-Cheng Wu, Te-An Chen | 2024-09-10 |
| 12021083 | Fin field-effect transistor and method of forming the same | Kam-Tou Sio, Jiann-Tyng Tzeng | 2024-06-25 |
| 12021021 | Integrated circuit structure | Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2024-06-25 |
| 12009364 | Semiconductor device and manufacture thereof | Shih-Wei Peng, Meng-Hung Shen, Jiann-Tyng Tzeng | 2024-06-11 |
| 11950413 | High voltage polysilicon gate in high-K metal gate device | Meng-Han Lin | 2024-04-02 |
| 11948974 | Semiconductor device including vertical transistor with back side power structure | Shih-Wei Peng, Jiann-Tyng Tzeng | 2024-04-02 |
| 11942469 | Backside conducting lines in integrated circuits | Wei-An Lai, Shih-Wei Peng, Jiann-Tyng Tzeng, Chung-Hsing Wang | 2024-03-26 |
| 11943921 | Embedded memory with improved fill-in window | Meng-Han Lin, Wei-Cheng Wu | 2024-03-26 |
| 11935830 | Integrated circuit with frontside and backside conductive layers and exposed backside substrate | Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng, Jiun-Wei Lu | 2024-03-19 |
| 11923427 | Semiconductor device | Meng-Han Lin, Wei-Cheng Wu | 2024-03-05 |
| 11923369 | Integrated circuit, system and method of forming the same | Wei-Cheng Lin, Wei-An Lai, Jiann-Tyng Tzeng | 2024-03-05 |
| 11916070 | Semiconductor structure with nanosheets | Kam-Tou Sio, Shang-Wei Fang, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2024-02-27 |
| 11894375 | Semiconductor structure and method of forming the same | Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2024-02-06 |